Publications

148 results for Thomas M. Shaw

The effect of voltage bias stress on temperature-dependent conduction properties of low-k dielectrics
- - Joanna Atkin
  - T.M. Shaw
  - et al.
- 2012
- IRPS 2012
Delayed mechanical failure of the under-bump interconnects by bump shearing
- - Han Li
  - Thomas M. Shaw
  - et al.
- 2012
- Journal of Applied Physics
Processing and moisture effects on TDDB for Cu/ULK BEOL structures
- - E. Liniger
  - T.M. Shaw
  - et al.
- 2012
- Microelectronic Engineering
Competitive and cost effective copper/low-k interconnect (BEOL) for 28 nm CMOS technologies
- - R. Augur
  - C. Child
  - et al.
- 2012
- Microelectronic Engineering
Robust ultrathin (20-25 nm) trilayer dielectric low k Cu damascene cap for sub-30 nm nanoelectronic devices
- - Son Nguyen
  - T. Haigh
  - et al.
- 2011
- ECS Meeting 2011
Interconnect processes and reliability for RF technology
- - Jeffrey P. Gambino
  - F. Anderson
  - et al.
- 2011
- IPFA 2011
Optimization of porous ultra low- dielectrics (κ≤ 2.55) for 28nm generation
- - D. Kioussis
  - E.T. Ryan
  - et al.
- 2011
- IITC/MAM 2011
The effect of grain size on microstructure and stress relaxation in polycrystalline Y₁Ba₂Cu₃O_7-δ
- - T.M. Shaw
  - S. Shinde
  - et al.
- 2011
- Journal of Materials Research
Carbon Retention in YBa₂Cu₃O_7−δ its Effect On The Superconducting Transition
- - T.M. Shaw
  - D. Dimos
  - et al.
- 2011
- Journal of Materials Research
Competitive and cost effective copper/low-k interconnect (BEOL) for 28nm CMOS technologies
- - Rod Augur
  - Craig Child
  - et al.
- 2010
- ADMETA 2010