Fully Encapsulated Fine Pitch Dual Damascene Organic RDL With Low Dk Df Photosensitive Polyimide and its Reliability
- Minhua Lu
- Joyce Liu
- et al.
- 2025
- ECTC 2025
Conference paper
Publications
32 results for D.L. Rath
Process Challenges in Fully Aligned Via Integration for sub 32 nm Pitch BEOL
- Benjamin D. Briggs
- C.B. Pcethala
- et al.
- 2018
- IITC 2018
Conference paperFully aligned via integration for extendibility of interconnects to beyond the 7 nm node
- Benjamin D. Briggs
- C.B. Peethala
- et al.
- 2017
- IEDM 2017
Conference paperResistance contributions to copper interconnects
- C. Witt
- F. Baumann
- et al.
- 2017
- IITC 2017
Conference paperCopper-to-dielectric heterogeneous bonding for 3D integration
- Wei Lin
- Juntao Li
- et al.
- 2014
- LTB-3D 2014
Conference paperCVD-Co/Cu(Mn) integration and reliability for 10 nm node
- Takeshi Nogami
- M. He
- et al.
- 2013
- IITC 2013
Conference paperTiN metal hard mask removal with selectivity to tungsten and TiN liner
- S. Lippy
- L. Chen
- et al.
- 2013
- ECS Transactions
Conference paperA novel low resistance gate fill for extreme gate length scaling at 20nm and beyond for gate-last high-k/metal gate CMOS technology
- U. Kwon
- K. Wong
- et al.
- 2012
- VLSI Technology 2012
Conference paperCoWP metal caps for reliable 32 nm 1X Cu interconnects in porous ULK (k=2.4)
- E. Huang
- M. Oh
- et al.
- 2009
- ADMETA 2009
Conference paperA multilevel copper/low-k/airgap BEOL technology
- S.V. Nitta
- S. Ponoth
- et al.
- 2007
- ADMETA 2007
Conference paper