Conference paperSelective Enablement of Dual Dipoles for near Bandedge Multi-Vt Solution in High Performance FinFET and Nanosheet TechnologiesRuqiang Bao, K. Watanabe, et al.VLSI Technology 2020
Conference paperBonding technologies for chip level and wafer level 3D integrationKatsuyuki Sakuma, Spyridon Skordas, et al.ECTC 2014
Conference paperSelective deposition of AlOx for Fully Aligned Via in nano Cu interconnectsSon Van Nguyen, Hosadurga Shobha, et al.IITC 2021
Conference paperRuthenium interconnect resistivity and reliability at 48 nm pitchXunyuan Zhang, Huai Huang, et al.IITC/AMC 2016
