Integrated Metamaterial Interfaces for Self-Aligned Fiber-to-Chip Coupling in Volume Manufacturing
- Tymon Barwicz
- Bo Peng
- et al.
- 2019
- IEEE JSTQE
Publications
12 results for Robert Leidy
Automated, high-throughput photonic packaging
- Tymon Barwicz
- Ted W. Lichoulas
- et al.
- 2018
- Optical Fiber Technology
Monolithic Silicon Photonic WDM Transceivers
- Jessie C. Rosenberg
- Folkert Horst
- et al.
- 2017
- ECOC 2017
High-throughput photonic packaging
- Tymon Barwicz
- Ted W. Lichoulas
- et al.
- 2017
- OFC 2017
Silicon photonics and challenges for fabrication
- N. Feilchenfeld
- Karen Nummy
- et al.
- 2017
- SPIE Advanced Lithography 2017
A novel approach to photonic packaging leveraging existing high-throughput microelectronic facilities
- Tymon Barwicz
- Yoichi Taira
- et al.
- 2016
- IEEE JSTQE
Enabling large-scale deployment of photonics through cost-efficient and scalable packaging
- Tymon Barwicz
- Yoichi Taira
- et al.
- 2015
- GFP 2015
Photonic packaging in high-throughput microelectronic assembly lines for cost-efficiency and scalability
- Tymon Barwicz
- Yoichi Taira
- et al.
- 2015
- OFC 2015
An o-band metamaterial converter interfacing standard optical fibers to silicon nanophotonic waveguides
- Tymon Barwicz
- Alexander Janta-Polczynski
- et al.
- 2015
- OFC 2015
An integrated silicon photonics technology for O-band datacom
- N. Feilchenfeld
- Frederick A. Anderson
- et al.
- 2015
- IEDM 2015