Conference paper
High-throughput photonic packaging
Tymon Barwicz, Ted W. Lichoulas, et al.
OFC 2017
Monolithic silicon photonic technology provides high bandwidth and large volume for datacom applications, while maintaining the low-cost assembly and waferscale test readiness characteristic of CMOS. Monolithic integration and high-yield CMOS processing enables complex, high-performance WDM architectures for CWDM4 transceivers.
Tymon Barwicz, Ted W. Lichoulas, et al.
OFC 2017
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AVFOP 2016
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GFP 2015