Effects of overlayers on electromigration reliability improvement for Cu/low K interconnects
- C.-K. Hu
- D. Canaperi
- et al.
- 2004
- IRPS 2004
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129 results for Eric G. Liniger
Comprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL
- D. Edelstein
- H.S. Rathore
- et al.
- 2004
- IRPS 2004
A study of electromigration lifetime for Cu interconnects coated with CoWP, Ta/TaN, or SiC xN yH z
- C.-K. Hu
- D. Canaperi
- et al.
- 2003
- AMC 2003
Correlation of electromigration lifetime distribution to failure mode in dual Damascene Cu/SiLK interconnects
- L. Gignac
- C.-K. Hu
- et al.
- 2003
- Microelectronic Engineering
Reduced Cu interface diffusion by CoWP surface coating
- C.-K. Hu
- L. Gignac
- et al.
- 2003
- Microelectronic Engineering
Comparison of Cu electromigration lifetime in Cu interconnects coated with various caps
- C.-K. Hu
- L. Gignac
- et al.
- 2003
- Applied Physics Letters
Effect of liner thickness on electromigration lifetime
- E. Liniger
- C.-K. Hu
- et al.
- 2003
- Journal of Applied Physics
Relationship between interfacial adhesion and electromigration in Cu metallization
- M.W. Lane
- E. Liniger
- et al.
- 2003
- Journal of Applied Physics
Relationship between interfacial adhesion and electromigration in Cu metallization
- J.R. Lloyd
- M.W. Lane
- et al.
- 2002
- IIRW 2002
Reduced electromigration of Cu wires by surface coating
- C.-K. Hu
- L. Gignac
- et al.
- 2002
- Applied Physics Letters