Detection of charge carrier confinement into mobile ionic defects in nanoporous dielectric films for advanced interconnects
- Juan Borja
- Joel L. Plawsky
- et al.
- 2014
- JVSTA
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129 results for Eric G. Liniger
Probing the interface barriers of dopant-segregated silicide-Si diodes with internal photoemission
- Zhen Zhang
- Joanna Atkin
- et al.
- 2012
- IEEE T-ED
Processing and moisture effects on TDDB for Cu/ULK BEOL structures
- E. Liniger
- T.M. Shaw
- et al.
- 2012
- Microelectronic Engineering
Synergistic combinations of dielectrics and metallization process technology to achieve 22 nm interconnect performance targets
- G.A. Antonelli
- G. Jiang
- et al.
- 2012
- Microelectronic Engineering
Electrolyte additive chemistry and feature size-dependent impurity incorporation for Cu interconnects
- J. Kelly
- Takeshi Nogami
- et al.
- 2012
- JES
Integration of photo-patternable low-κ material into advanced Cu back-end-of-the-line
- Qinghuang Lin
- Alshakim Nelson
- et al.
- 2010
- Japanese Journal of Applied Physics
Pore orientation and silylation effects on mesoporous silica film properties
- A.P. Singh
- D.D. Gandhi
- et al.
- 2009
- Applied Physics Letters
Comparison of electromigration in Cu interconnects with atomic-layer- or physical-vapor-deposited TaN liners
- C.-K. Hu
- L. Gignac
- et al.
- 2007
- JES
Line resistance and electromigration variations induced by hydrogen-based plasma modifications to the silicon carbonitride/copper interface
- E. Todd Ryan
- Jeremy Martin
- et al.
- 2007
- JES
The effect of Cu diffusion on the TDDB behavior in a low-k interlevel dielectrics
- J.R. Lloyd
- C.E. Murray
- et al.
- 2006
- Microelectronics Reliability