Publications

24 results for Akihiro Horibe

Thermally enhanced pre-applied underfills for 3D integration
- - Akihiro Horibe
  - Keishi Okamoto
  - et al.
- 2013
- ECTC 2013
Vacuum underfill technology for advanced packaging (IMPACT 2011)
- - M. Hoshiyama
  - M. Hasegawa
  - et al.
- 2011
- IMPACT 2011
Vacuum underfill technology for advanced packaging
- - Akihiro Horibe
  - M.-C. Paquet
  - et al.
- 2011
- ECTC 2011
High channel count connector for optical interconnect
- - Yoichi Taira
  - Fumiaki Yamada
  - et al.
- 2008
- OF&T 2008