Structure, design and process control for Cu bonded interconnects in 3D integrated circuits
- Kuan-Neng Chen
- Sang Hwui Lee
- et al.
- 2006
- IEDM 2006
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90 results for Meikei Ieong
Band-edge high-performance high-κ /metal gate n-MOSFETs using cap layers containing group IIA and IIIB elements with gate-first processing for 45 nm and beyond
- V. Narayanan
- V.K. Paruchuri
- et al.
- 2006
- VLSI Technology 2006
Nano-CMOS scaling: Novel devices and materials
- Meikei Ieong
- 2006
- NMDC 2006
Critical aspects of layer transfer and alignment tolerances for 3D integration processes
- D.C. La Tulipe
- L.T. Shi
- et al.
- 2006
- GBC 2006
Integration of local stress techniques with strained-Si directly on insulator (SSDOI) substrates
- Haizhou Yin
- Z. Ren
- et al.
- 2006
- VLSI Technology 2006
Novel approach to reduce source/drain series resistance in high performance CMOS devices using self-aligned CoWP process for 45nm node UTSOI transistors with 20nm gate length
- James Pan
- Anna Topol
- et al.
- 2006
- VLSI Technology 2006
Process induced stress for CMOS performance improvement
- S. Fang
- S.S. Tan
- et al.
- 2006
- ICSICT 2006
Three-dimensional integrated circuits
- Anna W. Topol
- Douglas C. La Tulipe Jr.
- et al.
- 2006
- IBM J. Res. Dev
Transistor scaling with novel materials
- Meikei Ieong
- Vijay Narayanan
- et al.
- 2006
- Materials Today
Hybrid-orientation technology (HOT): Opportunities and challenges
- Min Yang
- Victor W.C. Chan
- et al.
- 2006
- IEEE Transactions on Electron Devices