An XPS and TEM Study of Intrinsic Adhesion Between Polyimide and Cr Films
- N.J. Chou
- D.W. Dong
- et al.
- 2019
- JES
Publications
18 results for J. Kim
Adhesion test standardization for multichip module packages
- D.Y. Shih
- J. Kim
- et al.
- 1995
- ECTC 1995
Cu passivation: A method of inhibiting copper-polyamic acid interactions
- D.Y. Shih
- J. Kim
- et al.
- 1991
- Applied Physics Letters
Hydrothermal degradation of r.f. sputter-cleaned chromium-polyimide interfaces
- T.S. Oh
- D.G. Kim
- et al.
- 1991
- Journal of Materials Science Letters
Hydrothermal stability of Cr/polyimide interfaces
- D.G. Kim
- Steve Molis
- et al.
- 1991
- Journal of Adhesion Science and Technology
Adhesion Of Polyimides To Ceramics: Effects Of Aminopropyltriethoxysilane And Temperature And Humidity Exposure On Adhesion
- L.P. Buchwalter
- J. Kim
- et al.
- 1991
- Journal of Adhesion Science and Technology
Adhesion enhancement of Cr/polyimide interfaces using RF pre-sputtering of polyimide surfaces
- T.S. Oh
- S.P. Kowalczyk
- et al.
- 1990
- Journal of Adhesion Science and Technology
Adhesion of Polyimides to Ceramic Substrates: Role of Acid-Base Interactions
- T.S. Oh
- J. Kim
- et al.
- 1990
- Journal of Adhesion Science and Technology
Mechanical effects in peel adhesion test
- J. Kim
- K.S. Kim
- et al.
- 1989
- Journal of Adhesion Science and Technology
Elasto-plastic analysis of the peel test for thin film adhesion
- Kyung-Suk Kim
- Junglhl Kim
- 1988
- Journal of Engineering Materials and Technology, Transactions of the ASME