Adhesion Of Polyimides To Ceramics: Effects Of Aminopropyltriethoxysilane And Temperature And Humidity Exposure On Adhesion

The effects of both ׳-aminopropyltriethoxysilane (APS) and elevated temperature and humidity (T&H) exposure on the adhesion of pyromellitic dianhydride-oxydianiline polyimide to SiO, ΑΙ,Ο, and MgO were studied using XPS, SEM, and pee! test. Adhesion and T&H stability of PMDA-ODA on SiO, is significantly improved when APS is used at the interface, while no significant improvement is observed for A120, or MgO. XPS analysis of the surfaces showed no retention of APS on ΑΙ,Ο, or MgO, while Si02 did retain APS, as is expected. The APS retention is affected by surface treatment of the oxide prior to APS application. © 1991, VSP. All rights reserved.