Microelectronic Engineering

Paper

01 Jan 1985

Resist materials

View publication

Abstract

No abstract available.

Conference paper

NEW RELIABLE STRUCTURE FOR HIGH TEMPERATURE MEASUREMENT OF SILICON WAFERS USING A SPECIALLY ATTACHED THERMOCOUPLE.

S. Cohen, T.O. Sedgwick, et al.

MRS Proceedings 1983

Conference paper

Compression for data archiving and backup revisited

Corneliu Constantinescu

SPIE Optical Engineering + Applications 2009

Paper

(S)PEEC: Time- and Frequency-Domain Surface Formulation for Modeling Conductors and Dielectrics in Combined Circuit Electromagnetic Simulations

Dipanjan Gope, Albert E. Ruehli, et al.

IEEE T-MTT

Paper

On boundary conditions in lattice Boltzmann methods

Shiyi Chen, Daniel Martínez, et al.

Physics of Fluids

View all publications