Daniel J. Coady, Amanda C. Engler, et al.
ACS Macro Letters
Conference paper
New aqueous clean for aluminum interconnects: Part II. Applications
Abstract
The integration of a new aqueous clean, dSP+, has been demonstrated for aluminum interconnect technology in advanced DRAM products. The dSP+ chemistry was targeted for two back-end-of-line (BEOL) applications: post Al RIE clean and via clean. The results in this paper are discussed using SEM, reliability, and electrical parametric data.
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