Applications of clustering model to bimodal distributions for dielectric breakdown
- Ernest Y. Wu
- Ronald Bolam
- et al.
- 2017
- JVSTB
Paper
Publications
32 results for Ronald Filippi
Interconnects exhibiting enhanced electromigration short-length effects by line width variation
- Ronald Filippi
- P.-C. Wang
- et al.
- 2014
- IRPS 2014
Conference paperA time-dependent clustering model for non-uniform dielectric breakdown
- Ernest Y. Wu
- B. Li
- et al.
- 2013
- IEDM 2013
Conference paperElectrical properties and reliability of ALD TaN barrier for sub-90nmPitch Cu interconnects
- Tibor Bolom
- J. Lee
- et al.
- 2013
- ADMETA 2013
Conference paperThe effect of a threshold failure time and bimodal behavior on the electromigration lifetime of copper interconnects
- R. Filippi
- P.-C. Wang
- et al.
- 2009
- IRPS 2009
Conference paperMaterial and process for advanced Cu/ULK integration
- Chih-Chao Yang
- Daniel C. Edelstein
- et al.
- 2008
- ADMETA 2008
Conference paperThreshold electromigration failure time and its statistics for Cu interconnects
- Baozhen Li
- Cathryn Christiansen
- et al.
- 2006
- Journal of Applied Physics
PaperApplication of three-parameter lognormal distribution in EM data analysis
- Baozhen Li
- Emmanuel Yashchin
- et al.
- 2006
- Microelectronics Reliability
PaperMinimum void size and 3-parameter lognormal distribution for em failures in Cu interconnects
- Baozhen Li
- Cathryn Christiansen
- et al.
- 2006
- IRPS 2006
Conference paperA 45 nm CMOS node Cu/low-k/ ULtra low-k PECVD SiCOH (k=2.4) BEOL technology
- S. Sankaran
- S. Arai
- et al.
- 2006
- IEDM 2006
Conference paper