Conference paperAssembly and packaging of non-bumped 3D chip stacks on bumped substratesBing Dang, Joana Maria, et al.ECTC 2014
Conference paperNew tools and methodology for advanced parametric and defect structure testRaphael Robertazzi, Louis Medina, et al.IEEE ITC 2010
PaperA Cryo-CMOS Low-Power Semi-Autonomous Transmon Qubit State Controller in 14-nm FinFET TechnologySudipto Chakraborty, David J. Frank, et al.IEEE JSSC
Conference paperA Cryo-CMOS Transmon Qubit Controller and Verification with FPGA EmulationKevin Tien, Ken Inoue, et al.DATE 2022
