Maskless laser plating techniques for microelectronic materials
R.J. Von Gutfeld, M.H. Gelchinski, et al.
Proceedings of SPIE 1989
The authors identify and discuss the following distinct modes of deposition: electroless enhanced plating, selective immersion plating, laser-enhanced electroplating of copper and gold, and laser jet plating. In addition to plating, it was demonstrated that the laser-enhanced techniques are also applicable to electroetching and selective chemical etching of stainless steel and materials such as Al//2O//3,TiC, Si, polyimide, etc. The authors also discuss a new approach to highly selective, maskless plating and etching methods which exceeds any plating or etching rates known to date.
R.J. Von Gutfeld, M.H. Gelchinski, et al.
Proceedings of SPIE 1989
J.W. Chang, P.C. Andricacos, et al.
ECS Meeting 1989
L. Romankiw
AESF Annual Technical Conference 1990
D.L. Rath, Dieter M. Kolb, et al.
ECS Meeting 1983