J.M. Shaw, J. Gelorme, et al.
IBM J. Res. Dev
Paper
Future packaging materials: Cost performance, and environmental issues
Related
D.Y. Shih, B. Dang, et al.
ICEPT-HDP 2008
Marie Angelopoulos, J. Gelorme, et al.
MRS Fall Meeting 1993
J.M. Shaw, M. Hatzakis
JES