Feasibility Study of Si Handler Debonding by Laser Release
- Bing Dang
- Thomas Wassick
- et al.
- 2016
- ECTC 2016
Conference paper
Publications
29 results for Jeffrey Gelorme
Wafer IMS (Injection molded solder) - A new fine pitch solder bumping technology on wafers with solder alloy composition flexibility
- Jae Woong Nah
- Jeffrey Gelorme
- et al.
- 2014
- ECTC 2014
Conference paperMixing, rheology, and stability of highly filled thermal pastes
- Claudius Feger
- Jeffrey D. Gelorme
- et al.
- 2005
- IBM J. Res. Dev
PaperN-type organic thin-film transistor with high field-effect mobility based on a N,N′-dialkyl-3,4,9,10-perylene tetracarboxylic diimide derivative
- Patrick R. L. Malenfant
- Christos D. Dimitrakopoulos
- et al.
- 2002
- Applied Physics Letters
PaperDevelopment of conductive adhesive materials for via fill applications
- Sung K. Kang
- Stephen L. Buchwalter
- et al.
- 2001
- IEEE Transactions on Components and Packaging Technologies
PaperLithographically fabricated fiber guides for optical subassemblies
- M.S. Cohen
- Mike Cordes
- et al.
- 2001
- ECTC 2001
Conference paperIntroducing biobased materials into the electronics industry: Developing a lignin-based resin for printed wiring boards
- Laura L. Kosbar
- Jeffrey D. Gelorme
- et al.
- 2000
- Journal of Industrial Ecology
PaperPatterning of highly conducting polyaniline films
- T. Graham
- A. Afzali
- et al.
- 2000
- Microlithography 2000
Conference paperSynthesis and lithographic performance of poly-4-hydroxyphenyl ethyl methacrylate based negative resists
- J. Gelorme
- L.L. Kosbar
- et al.
- 2000
- Microlithography 2000
Conference paperDevelopment of conductive adhesive materials for via fill applications
- Sung K. Kang
- Stephen L. Buchwalter
- et al.
- 2000
- Proceedings - Electronic Components and Technology Conference
Paper