PROCESSING CONCERNS FOR MULTI-LEVEL THIN FILM METALLIZATION.
C. Narayan, J.E. Lewis, et al.
ECS Meeting 1986
Tensile mechanical behavior of as-cast solid mercury which is relevant to Josephson integrated circuit packaging applications has been studied at 77 K and between 4.2 and 20 K. It was found that solid mercury is ductile, particularly so at temperatures close to 4.2 K. Further, at and near 4.2 K solid mercury exhibits pronounced work hardening, high tensile strength, and markedly serrated flow behavior. A possible explanation of these observations is presented, based on existing information on deformation and transformation characteristics of mercury at cryogenic temperatures.
C. Narayan, J.E. Lewis, et al.
ECS Meeting 1986
C. Narayan, S. Purushothaman, et al.
MCMC 1994
C. Dimitrakopoulos, S. Purushothaman, et al.
DRC 1999
D. Neuaroschl, B.K. Furman, et al.
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films