AGING RESPONSE AND CRYOGENIC MECHANICAL PROPERTIES OF AN In-Sn EUTECTIC SOLDER ALLOY FOR JOSEPHSON PACKAGING.
- T. Caulfield
- S. Purushothaman
- et al.
- 1983
- International Cryogenic Materials Conference 1983
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4 results for T. Caulfield
A High-Density, Four-Channel, OEIC Transceiver Module Utilizing Planar-Processed Optical Waveguides and Flip-Chip, Solder-Bump Technology
- K. Jackson
- E.B. Flint
- et al.
- 1994
- Journal of Lightwave Technology
Cryogenic temperature mechanical behavior of solid mercury
- S. Purushothaman
- T. Caulfield
- 1984
- Journal of Applied Physics
On the differences in the cryogenic tensile properties of the constitutent phases in the InSn eutectic alloy
- S. Purushotham
- T. Caulfield
- 1984
- Scripta Metallurgica