Eric J. Fluhr, Joshua Friedrich, et al.
ISSCC 2014
The POWER6™ is a dual-core microprocessor fabricated in a 65nm SOI process with 10 levels of low-k copper interconnects. Chips with split- and connected-core power supplies are fabricated, modeled, and tested, showing both the advantages and disadvantages of each. On-chip noise measurements are compared to simulation. The noise measurements and simulation both show that the shorted core power grid design has less noise and a higher maximum frequency. © 2007 IEEE.
Eric J. Fluhr, Joshua Friedrich, et al.
ISSCC 2014
Matt Park, John Bulzacchelli, et al.
ISSCC 2007
Joachim Clabes, Joshua Friedrich, et al.
ISSCC 2003
Daeik D. Kim, Jonghae Kim, et al.
ISSCC 2007