R. Hammer, N.J. Chou, et al.
Journal of Electronic Materials
Phosphorus redistribution during thermal oxidation of degenerately doped silicon was investigated using Auger electron spectroscopy and ellipsometry. Concentration profiles were determined with a combination of chemical and sputter etching techniques. A substantial phosphorus pileup was observed in the oxide in a thin layer near the ellipsometrically determined SiSingle Bond signSiO2 interface. Calibrated against standards of known concentration, this layer was found to contain ∼2×1021 phosphorus atoms/cm3, independent of the oxidation temperature between 850 and 1000°C. © 1974 American Institute of Physics.