Publications

4 results for Sathya Raghavan

Advanced Acoustic Emission (AE) Sensing and Analytics Scheme for In-situ Warpage Characterizations of Flip-Chip Packaging
- - Yigit Turan
  - Xinchen Wang
  - et al.
- 2026
- ECTC 2026
Poster
D2W and W2W Hybrid bonding system with below 2.5 micron pitch for 3D chiplet AI applications
- - Katsuyuki Sakuma
  - Roy Yu
  - et al.
- 2024
- IEDM 2024
Invited talk
The impact of Al on contact resistance and its suitability in fine pitch interconnects
- - Fee Li Lie
  - Sathya Raghavan
  - et al.
- 2023
- IMAPS 2023
Conference paper
Artificial Intelligence (AI) based methodology to minimize asymmetric bare substrate warpage
- - Sathya Raghavan
  - Hiroyuki Mori
  - et al.
- 2023
- ECTC 2023
Poster