Remembering Dick Garwin, renowned engineer and advisor
News
Mike Murphy
Science
Our focus extends beyond just increasing the rate of scientific discovery; it's about laying new technological foundations that can be applied across multiple fields, driving significant advancements in climate science, materials discovery, healthcare, and more.
Our work
Miklós Ajtai and Regina Barzilay received IEEE medals for applying unexpected methods to computer science
NewsPeter HessIBM and ESA open-source TerraMind, the best performing generative AI model for Earth observation
ReleaseAshley PetersonSimplifying geospatial AI with TerraTorch 1.0
Technical noteRomeo Kienzler, Juan Bernabé-Moreno, Paolo Fraccaro, Bianca Zadrozny, Campbell Watson, Benedikt Blumenstiel, Joao Lucas de Sousa Almeida, Michael Johnston, Christian Pinto, and Michal MuszynskiIBM and Université de Sherbrooke announce two quantum research chairs
Q & AAlexandre ChoquetteIBM’s quantum-safe signature schemes advance in NIST’s PQC process
Technical noteWard Beullens and Luca De Feo- See more of our work on Science
Topics
Accelerated Discovery
The world is changing rapidly every day, and the way we used to solve problems won’t cut it anymore. At IBM Research, we’re combining our expertise in quantum computing, AI, and hybrid cloud to drastically increase how quickly we can discover solutions to tackle today’s most urgent problems.Materials Discovery
It can take over 10 years to come up with new materials. At IBM Research, we’re looking to accelerate the discovery process using new AI methods, robotics, the hybrid cloud, and quantum computers. Our goal is to unlock new properties and materials to address global challenges in years not decades.
Publications
MDLab: AI frameworks for Carbon Capture and Battery Materials
- Bruce Elmegreen
- Hendrik Hamann
- et al.
- 2025
- Frontiers in Environmental Science
CIRCUITSYNTH-RL: LLM-Based Circuit Topology Synthesis with RL Refinement
- Prashanth Vijayaraghavan
- Luyao Shi
- et al.
- 2025
- DAC 2025
Novel Advanced Low-k Dielectric for 2 nm and Beyond Cu and Post Cu Dual Damascene BEOL Interconnect Technologies
- Son Nguyen
- Huai Huang
- et al.
- 2025
- VLSI Technology and Circuits 2025
Electrical Performance of Hybrid Bonding with Sub-Micron Cu-Cu Bonding Contacts: Effects of Scaling, Microstructure, and Surface Morphology
- Sari Zerey
- Alina Bennett-dubin
- et al.
- 2025
- ECTC 2025
Fast And Accurate Machine Learning Prediction of Back-End-Of-Line Thermal Resistances in Backside Power Delivery and Chiplet Architectures
- Prabudhya Roy Chowdhury
- Aakrati Jain
- et al.
- 2025
- ECTC 2025
Guardrails in generative AI workflows via orchestration
- Gaurav Kumbhat
- Evaline Ju
- 2025
- ODSC East 2025
The fastest path to progress
Watch a new short film on the computing revolutions that are accelerating the rate of scientific discovery like nothing before.
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