Publications

8 results at JOM

Electromigration performance of Pb-free solder joints in terms of solder composition and joining path
- - Sun-Kyoung Seo
  - Sung K. Kang
  - et al.
- 2010
- JOM
Paper
An overview of Pb-free, flip-chip wafer-bumping technologies
- - Sung K. Kang
  - Peter Gruber
  - et al.
- 2008
- JOM
Review
The oxidation of lead-free Sn alloys by electrochemical reduction analysis
- - Sungil Cho
  - Jin Yu
  - et al.
- 2005
- JOM
Paper
Controlling Ag₃Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying
- - Sung K. Kang
  - Da-Yuan Shih
  - et al.
- 2004
- JOM
Paper
Ag₃Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu
- - Sung K. Kang
  - Won Kyoung Choi
  - et al.
- 2003
- JOM
Paper
The status of two-dimensional Si/SiGe heterostructures
- - Shelby F. Nelson
- 1993
- JOM
Paper
Interconnection technologies and materials science
- - W.L. Winterbottom
  - S.K. Kang
- 1991
- JOM
Review
The application of expert systems to process control
- - Bevan P.F. Wu
- 1991
- JOM
Paper