Publications

33 results at ECS Transactions

Dielectric damage
- - H. Ren
  - S. Banna
  - et al.
- 2014
- ECS Transactions
Top level bus estimation for hierarchical design
- - Ou He
  - Suoming Pu
  - et al.
- 2014
- ECS Transactions
Hierarchical timing signoff in high performance ASIC design
- - Gongqiong Li
  - Hongwei Dai
  - et al.
- 2014
- ECS Transactions
Electrodeposited Cu film morphology on thin PVD Cu seed layers
- - James J. Kelly
  - X. Lin
  - et al.
- 2013
- ECS Transactions
Recent developments in ST-MRAM, including scaling
- - Eugene J. O'Sullivan
  - Martin J. Gajek
  - et al.
- 2013
- ECS Transactions
Optimization of Cu damascene electrodeposition process in ULSI for yield and reliability improvement
- - Ingrid Shao
  - T. Cheng
  - et al.
- 2013
- ECS Transactions
TiN metal hard mask removal with selectivity to tungsten and TiN liner
- - S. Lippy
  - L. Chen
  - et al.
- 2013
- ECS Transactions
Physical and electrical properties of scaled gate stacks on Si/passivated In_0.53Ga_0.47As
- - Chiara Marchiori
  - Mario El Kazzi
  - et al.
- 2013
- ECS Transactions
X-ray characterization of PEALD versus PVD tantalum nitride barrier deposition and the impact on via contact resistance
- - Xunyuan Zhang
  - Oscar Van der Straten
  - et al.
- 2013
- ECS Transactions
In situ growth of Si nanowires using transmission electron microscopy
- - Yi-Chia Chou
  - Cheng-Yen Wen
  - et al.
- 2013
- ECS Transactions