Spectral interferometry for fully integrated device metrologyDaniel SchmidtManasa Medikondaet al.2023JM3
Bayesian dropout approximation in deep learning neural networks: Analysis of self-Aligned quadruple patterningScott D. HalleDerren N. Dunnet al.2022JM3
Dry heterometallic resist processing based on thermal sublimation deposition and developmentDario GoldfarbScott Lewiset al.2022JM3
In-line Raman spectroscopy for gate-all-around nanosheet device manufacturingDaniel SchmidtCurtis Durfeeet al.2022JM3
Review of nanosheet metrology opportunities for technology readinessMary A. BretonDaniel Schmidtet al.2022JM3
Chemical and structural characterization of EUV photoresists as a function of depth by standing-wave x-ray photoelectron spectroscopyGiuseppina ContiHenrique P. Martinset al.2021JM3
Contribution of EUV resist counting statistics to stochastic printing failuresWilliam D. HinsbergGregory M. Wallraffet al.2021JM3