Publications

118 results at Journal of Electronic Materials

Oxide-Free Copper Pastes for the Attachment of Large-Area Power Devices
- - Luca Del Carro
  - Alfred A. Zinn
  - et al.
- 2019
- Journal of Electronic Materials
Recrystallization as a Growth Mechanism for Whiskers on Plastically Deformed Sn Films
- - Jaewon Chang
  - Sung K. Kang
  - et al.
- 2015
- Journal of Electronic Materials
Effects of sodium citrate concentration on electroless Ni-Fe bath stability and deposition
- - Myung-Won Jung
  - Sung K. Kang
  - et al.
- 2013
- Journal of Electronic Materials
Investigation of Sn whisker growth in electroplated Sn and Sn-Ag as a function of plating variables and storage conditions
- - Jaewon Chang
  - Sung K. Kang
  - et al.
- 2013
- Journal of Electronic Materials
Measurement of thermoelectric properties of single semiconductor nanowires
- - Siegfried Karg
  - Philipp Mensch
  - et al.
- 2013
- Journal of Electronic Materials
Low-temperature epitaxy of compressively strained silicon directly on silicon substrates
- - Davood Shahrjerdi
  - Bahman Hekmatshoar
  - et al.
- 2011
- Journal of Electronic Materials
Investigation and effects of wafer bow in 3D integration bonding schemes
- - K.N. Chen
  - Y. Zhu
  - et al.
- 2010
- Journal of Electronic Materials
The crystal orientation of β-Sn grains in Sn-Ag and Sn-Cu solders affected by their interfacial reactions with Cu and Ni(P) under bump metallurgy
- - Sun-Kyoung Seo
  - Sung K. Kang
  - et al.
- 2009
- Journal of Electronic Materials
Interfacial reactions and microstructures of Sn-0.7Cu-xZn solders with ni-P UBM during thermal aging
- - Moon Gi Cho
  - Sung K. Kang
  - et al.
- 2009
- Journal of Electronic Materials
An investigation of microstructure and microhardness of Sn-Cu and Sn-Ag solders as functions of alloy composition and cooling rate
- - Sun-Kyoung Seo
  - Sung K. Kang
  - et al.
- 2008
- Journal of Electronic Materials