Energy-Aware Signal Integrity Analysis for High-Speed PCB Links
- Sebastian Müller
- Torsten Reuschel
- et al.
- 2015
- IEEE Trans Electromagn Compat
Paper
Publications
16 results at IEEE Trans Electromagn Compat
A rigorous approach for the radiated emission characterization based on the spherical magnetic field scanning
- Ping Li
- Li Jun Jiang
- 2014
- IEEE Trans Electromagn Compat
PaperPartial and internal inductance: Two of Clayton R. Paul's many passions
- Christopher L. Holloway
- Edward F. Kuester
- et al.
- 2013
- IEEE Trans Electromagn Compat
PaperAccuracy of physics-based via models for simulation of dense via arrays
- Sebastian Müller
- Xiaomin Duan
- et al.
- 2012
- IEEE Trans Electromagn Compat
PaperMultipoint full-wave model order reduction for delayed PEEC models with large delays
- Francesco Ferranti
- Michel S. Nakhla
- et al.
- 2011
- IEEE Trans Electromagn Compat
PaperCircuital modeling and measurement of shielding effectiveness against oblique incident plane wave on apertures in multiple sides of rectangular enclosure
- Jongjoo Shim
- Dong Gun Kam
- et al.
- 2010
- IEEE Trans Electromagn Compat
PaperApplication of the short-pulse propagation technique for broadband characterization of PCB and other interconnect technologies
- Alina Deutsch
- Roger S. Krabbenhoft
- et al.
- 2010
- IEEE Trans Electromagn Compat
PaperFast EMI analysis via transverse partitioning and waveform relaxation
- Arvind R. Sridhar
- Natalie M. Nakhla
- et al.
- 2009
- IEEE Trans Electromagn Compat
PaperImpact of partial element accuracy on PEEC model stability
- Jonas Ekman
- Giulio Antonini
- et al.
- 2006
- IEEE Trans Electromagn Compat
PaperNonorthogonal PEEC formulation for time- and frequency-domain EM and circuit modeling
- Albert E. Ruehli
- Giulio Antonini
- et al.
- 2003
- IEEE Trans Electromagn Compat
Paper