Publications

29 results at IEEE Transactions on CPMT

Fabrication and Performance of 300-mm Wafer-Scale Silicon Microchannel Cooler
- - Evan G. Colgan
  - Kai Schleupen
  - et al.
- 2023
- IEEE Transactions on CPMT
3-D Die Stacking with 55 μm Pitch Interconnections on Advanced Ground-Rule Laminate for Artificial Intelligence System
- - Katsuyuki Sakuma
  - Mukta Farooq
  - et al.
- 2021
- IEEE Transactions on CPMT
Modeling Effect of Grain Orientation on Degradation in Tin-Based Solder - Part II: Electromigration Experiments
- - Jiamin Ni
  - Matt Ring
  - et al.
- 2019
- IEEE Transactions on CPMT
Foreword: Special Section on Packaging and Interconnects: Cutting-Edge Solutions in Modeling, Design, and Characterization - Part i
- - Mihai Telescu
  - Xiaoxiong Gu
  - et al.
- 2019
- IEEE Transactions on CPMT
Modeling effect of grain orientation on degradation in tin-based solder: I. current-driven diffusion
- - Yuanxiang Zhang
  - Jiamin Ni
  - et al.
- 2019
- IEEE Transactions on CPMT
Thermally Conductive Composite Material with Percolating Microparticles Applied as Underfill
- - Rahel Straessle
  - Severin Zimmermann
  - et al.
- 2018
- IEEE Transactions on CPMT
Efficient Prediction of Equalization Effort and Channel Performance for PCB-Based Data Links
- - Torsten Reuschel
  - Jan B. Preibisch
  - et al.
- 2017
- IEEE Transactions on CPMT
Improving Data Center Energy Efficiency With Advanced Thermal Management
- - Timothy Chainer
  - Mark D. Schultz
  - et al.
- 2017
- IEEE Transactions on CPMT
Optical Transceiver Module for 1.2 Tb/s Based on Flexible Circuit Technology
- - Jonas Weiss
  - Daniel Jubin
  - et al.
- 2017
- IEEE Transactions on CPMT
Enhanced percolating thermal underfills achieved by means of nanoparticle bridging necks
- - Jonas Zürcher
  - Xi Chen
  - et al.
- 2016
- IEEE Transactions on CPMT