3D Chip stacking with 50 μm pitch lead-free micro-c4 interconnections
- Joana Maria
- Bing Dang
- et al.
- 2011
- ECTC 2011
Conference paper
Publications
16 results at ECTC 2011
A through-silicon-via to active device noise coupling study for CMOS SOI technology
- Xiaomin Duan
- Xiaoxiong Gu
- et al.
- 2011
- ECTC 2011
Conference paperDevelopment of wafer level underfill materials and assembly processes for fine pitch Pb-free solder flip chip packaging
- Jae-Woong Nah
- Michael A. Gaynes
- et al.
- 2011
- ECTC 2011
Conference paperFluxless bonding for fine-pitch and low-volume solder 3-D interconnections
- Katsuyuki Sakuma
- Kazushige Toriyama
- et al.
- 2011
- ECTC 2011
Conference paperElectromagnetic-SPICE modeling and analysis of 3D power network
- Zheng Xu
- Jian-Qiang Lu
- et al.
- 2011
- ECTC 2011
Conference paperTechniques for de-embedding a high port count connector to PCB via interposer
- Yan Ding
- Young H. Kwark
- et al.
- 2011
- ECTC 2011
Conference paperElectromigration analysis of peripheral ultra fine pitch C2 flip chip interconnection with solder capped Cu pillar bump
- Yasumitsu Orii
- Kazushige Toriyama
- et al.
- 2011
- ECTC 2011
Conference paperVacuum underfill technology for advanced packaging
- Akihiro Horibe
- M.-C. Paquet
- et al.
- 2011
- ECTC 2011
Conference paperMinor alloying effects of Ni or Zn on microstructure and microhardness of Pb-free solders
- Sun-Kyoung Seo
- Moon Gi Cho
- et al.
- 2011
- ECTC 2011
Conference paperSolder/adhesive bonding using simple planarization technique for 3D integration
- Masatsugu Nimura
- Jun Mizuno
- et al.
- 2011
- ECTC 2011
Conference paper