Electrical assessment of chip to chip connection for ultra high density organic interposer
- Keishi Okamoto
- Hiroyuki Mori
- et al.
- 2014
- ICEP 2014
Conference paper
Publications
4 results at ICEP 2014
Nanomaterials for silicon photonic packaging spin-on nanomaterials for optical packaging
- Yoichi Taira
- Kuniaki Sueoka
- et al.
- 2014
- ICEP 2014
Conference paperCharacterization of micro bump formed by Injection Molded Solder (IMS) technology
- Toyohiro Aoki
- Kazushige Toriyama
- et al.
- 2014
- ICEP 2014
Conference paperFine-pitch solder joining for high density interconnection
- Kuniaki Sueoka
- Sayuri Kohara
- et al.
- 2014
- ICEP 2014
Conference paper