Conference paper
High-throughput photonic packaging
Tymon Barwicz, Ted W. Lichoulas, et al.
OFC 2017
Fine precision is necessary in assembling silicon photonics devices, because of single mode optical signals and smaller waveguides on silicon due to the high refractive index of silicon. It is necessary to lower the loss in the optical path for low power and stable operation of optical transceivers,. We report on several new approaches to solve the precision requirement and low loss requirement by using novel spin-on nanomaterials. We discuss possible application schemes in the silicon photonic packaging by using of these materials © 2014 JIEP.
Tymon Barwicz, Ted W. Lichoulas, et al.
OFC 2017
Katsuyuki Sakuma, Spyridon Skordas, et al.
ECTC 2014
Tymon Barwicz, Yoichi Taira, et al.
GFP 2015
Keiji Matsumoto, Yoichi Taira
SEMI-THERM 2009