Publications

13 results at InterPACK 2015

Validation study for VOF simulations of boiling in a microchannel
- - Catherine Gorle
  - Hyoungsoon Lee
  - et al.
- 2015
- InterPACK 2015
Conference paper
Effects of low CTE materials on thermal deformation of organic substrates in flip chip package application
- - Hiroyuki Mori
  - Sayuri Kohara
  - et al.
- 2015
- InterPACK 2015
Conference paper
Embedded two-phase cooling of large 3D compatible chips with radial channels
- - Mark D. Schultz
  - Fanghao Yang
  - et al.
- 2015
- InterPACK 2015
Conference paper
Eulerian multiphase conjugate model for chip-embedded microchannel flow boiling
- - Pritish R. Parida
  - Hsin-Hua Tsuei
  - et al.
- 2015
- InterPACK 2015
Conference paper
Integrate monolithic nanostructures in microchannels to enhance flow boiling heat transfer of HFE-7000
- - Fanghao Yang
  - Xiaochuan Li
  - et al.
- 2015
- InterPACK 2015
Conference paper
LID-integral cold plate topology integration, performance, and reliability
- - Gerd Schlottig
  - Marco De Fazio
  - et al.
- 2015
- InterPACK 2015
Conference paper
Local measurements of flow boiling heat transfer on hot spots In 3D compatible radial microchannels
- - Fanghao Yang
  - Mark D. Schultz
  - et al.
- 2015
- InterPACK 2015
Conference paper
Discrete control of air conditioning units in mission critical facilities
- - Sergio A. Bermudez
  - Hendrik Hamann
  - et al.
- 2015
- InterPACK 2015
Conference paper
Reduced order modeling for chip-embedded micro-channel flow boiling
- - Pritish R. Parida
- 2015
- InterPACK 2015
Conference paper
Effect of relative humidity, Temperature and gaseous and particulate contaminations on information technology equipment reliability
- - Prabjit Singh
  - Levente J. Klein
  - et al.
- 2015
- InterPACK 2015
Conference paper