The influence of low level doping on the thermal evolution of SAC alloy solder joints with Cu pad structures
- Isabel De Sousa
- Donald W. Henderson
- et al.
- 2006
- ECTC 2006
Conference paper
Publications
13 results at ECTC 2006
Packaging considerations for high-speed single-ended and differential nets
- Lei Shan
- Mohit Kapur
- et al.
- 2006
- ECTC 2006
Conference paperSystem-on-Package (SOP) technology, characterization and applications
- J. Knickerbocker
- P. Andry
- et al.
- 2006
- ECTC 2006
Conference paperCharacterization of micro-bump C4 interconnects for Si-carrier SOP applications
- S.L. Wright
- R.J. Polastre
- et al.
- 2006
- ECTC 2006
Conference paperA 60GHz radio chipset fully-integrated in a low-cost packaging technology
- U. Pfeiffer
- J. Gizyb
- et al.
- 2006
- ECTC 2006
Conference paperPassive alignment of optical elements in a printed circuit board
- T. Lamprecht
- F. Horst
- et al.
- 2006
- ECTC 2006
Conference paperElectrical-optical high speed serial server scalability link
- D.N. De Araujo
- M. Cases
- et al.
- 2006
- ECTC 2006
Conference paperPb-free micro-joints (50 μm pitch) for the next generation micro-systems: The fabrication, assembly and characterization
- H. Gan
- S.L. Wright
- et al.
- 2006
- ECTC 2006
Conference paperOptical high speed symmetric multi-processor link implementation
- Daniel Kuchta
- Christian Baks
- et al.
- 2006
- ECTC 2006
Conference paperMCM LGA package with optical I/O passively aligned to dual layer polymer waveguides in PCB
- Frank R. Libsch
- R. Budd
- et al.
- 2006
- ECTC 2006
Conference paper