Publications

18 results at ECTC 2008

Controlling the interfacial reactions in Pb-free interconnections by adding minor alloying elements to Sn-rich solders
- - Sung K. Kang
  - Moon Gi Cho
  - et al.
- 2008
- ECTC 2008
300-Gb/s 24-channel bidirectional Si carrier transceiver optochip for board-level interconnects
- - Fuad E. Doany
  - Clint L. Schow
  - et al.
- 2008
- ECTC 2008
Development of a 50mm dual flip chip plastic land grid array package for server applications
- - Sylvain Ouimet
  - Jon Casey
  - et al.
- 2008
- ECTC 2008
Reliability testing of through-silicon vias for high-current 3D applications
- - Steven L. Wright
  - Paul S. Andry
  - et al.
- 2008
- ECTC 2008
3D stacking of chips with electrical and microfluidic I/O interconnects
- - Calvin R. King Jr.
  - Deepak Sekar
  - et al.
- 2008
- ECTC 2008
On-chip 3-D technology independent model for millimeter-wave transmission lines with bend in BiCMOS technologies
- - Guoan Wang
  - Hanyi Ding
  - et al.
- 2008
- ECTC 2008
Massively parallel full-wave modeling of advanced packaging structures on BlueGene supercomputer
- - J.D. Morsey
  - L. Jiang
  - et al.
- 2008
- ECTC 2008
50μm pitch Pb-free micro-bumps by C4NP technology
- - Bing Dang
  - Da-Yuan Shih
  - et al.
- 2008
- ECTC 2008
Characterization of stacked die using die-to-wafer integration for high yield and throughput
- - K. Sakuma
  - P. Andry
  - et al.
- 2008
- ECTC 2008
The viability of 25 Gb/s on-board signalling
- - Mark B. Ritter
  - Petar Pepeljugoski
  - et al.
- 2008
- ECTC 2008