Controlling the interfacial reactions in Pb-free interconnections by adding minor alloying elements to Sn-rich solders
- Sung K. Kang
- Moon Gi Cho
- et al.
- 2008
- ECTC 2008
Conference paper
Publications
18 results at ECTC 2008
C4NP Cu-cored Pb-free flip chip interconnections
- Jae-Woong Nah
- Stephen L. Buchwalter
- et al.
- 2008
- ECTC 2008
Conference paper3D silicon integration
- J. Knickerbocker
- P. Andry
- et al.
- 2008
- ECTC 2008
Conference paperNovel low-cost on-chip CPW slow-wave structure for compact RF components and mm-wave applications
- Guoan Wang
- Wayne Woods
- et al.
- 2008
- ECTC 2008
Conference paperPerformance improvement of stacked graphite sheets for cooling applications
- Yoichi Taira
- Sayuri Kohara
- et al.
- 2008
- ECTC 2008
Conference paper300-Gb/s 24-channel bidirectional Si carrier transceiver optochip for board-level interconnects
- Fuad E. Doany
- Clint L. Schow
- et al.
- 2008
- ECTC 2008
Conference paperDevelopment of a 50mm dual flip chip plastic land grid array package for server applications
- Sylvain Ouimet
- Jon Casey
- et al.
- 2008
- ECTC 2008
Conference paperReliability testing of through-silicon vias for high-current 3D applications
- Steven L. Wright
- Paul S. Andry
- et al.
- 2008
- ECTC 2008
Conference paper3D stacking of chips with electrical and microfluidic I/O interconnects
- Calvin R. King Jr.
- Deepak Sekar
- et al.
- 2008
- ECTC 2008
Conference paperOn-chip 3-D technology independent model for millimeter-wave transmission lines with bend in BiCMOS technologies
- Guoan Wang
- Hanyi Ding
- et al.
- 2008
- ECTC 2008
Conference paper