Controlling the interfacial reactions in Pb-free interconnections by adding minor alloying elements to Sn-rich solders
- Sung K. Kang
- Moon Gi Cho
- et al.
- 2008
- ECTC 2008
Conference paper
Publications
18 results at ECTC 2008
Reliability testing of through-silicon vias for high-current 3D applications
- Steven L. Wright
- Paul S. Andry
- et al.
- 2008
- ECTC 2008
Conference paper3D stacking of chips with electrical and microfluidic I/O interconnects
- Calvin R. King Jr.
- Deepak Sekar
- et al.
- 2008
- ECTC 2008
Conference paperOn-chip 3-D technology independent model for millimeter-wave transmission lines with bend in BiCMOS technologies
- Guoan Wang
- Hanyi Ding
- et al.
- 2008
- ECTC 2008
Conference paperMassively parallel full-wave modeling of advanced packaging structures on BlueGene supercomputer
- J.D. Morsey
- L. Jiang
- et al.
- 2008
- ECTC 2008
Conference paper50μm pitch Pb-free micro-bumps by C4NP technology
- Bing Dang
- Da-Yuan Shih
- et al.
- 2008
- ECTC 2008
Conference paperCharacterization of stacked die using die-to-wafer integration for high yield and throughput
- K. Sakuma
- P. Andry
- et al.
- 2008
- ECTC 2008
Conference paperThe viability of 25 Gb/s on-board signalling
- Mark B. Ritter
- Petar Pepeljugoski
- et al.
- 2008
- ECTC 2008
Conference paperComparison of electromigration performance for Pb-free solders and surface finishes with Ni UBM
- Minhua Lu
- Paul Lauro
- et al.
- 2008
- ECTC 2008
Conference paper300-Gb/s 24-channel bidirectional Si carrier transceiver optochip for board-level interconnects
- Fuad E. Doany
- Clint L. Schow
- et al.
- 2008
- ECTC 2008
Conference paper