22 nm technology compatible fully functional 0.1 μm 2 6T-sram cellB. HaranA. Kumaret al.2008IEDM 2008
32nm general purpose bulk CMOS technology for high performance applications at low voltageF. ArnaudJ. Liuet al.2008IEDM 2008
A statistical study of magnetic tunnel junctions for high-density spin torque transfer-MRAM (STT-MRAM)R. BeachT. Minet al.2008IEDM 2008
MOSFET performance scaling: Limitations and future optionsDimitri A. AntoniadisAli Khakifirooz2008IEDM 2008
A 300-mm wafer-level three-dimensional integration scheme using tungsten through-silicon via and hybrid cu-adhesive bondingF. LiuR.R. Yuet al.2008IEDM 2008
High-performance nMOSFET with in-situ phosphorus-doped embedded Si:C (ISPD eSi:C) source-drain stressorB. YangR. Takalkaret al.2008IEDM 2008
Demonstration of highly scaled FinFET SRAM cells with high-Κ/metal gate and investigation of characteristic variability for the 32 nm node and beyondH. KawasakiM. Khateret al.2008IEDM 2008
Gate length scaling and high drive currents enabled for high performance SOI technology using high-κ/metal gateK. HensonH. Buet al.2008IEDM 2008