Effect of strain on diffusion kinetics and activation energy for al grain-boundary diffusion: A computer simulation
- Thomas Kwok
- 1992
- SPIE Microelectronic Processing 1992
Conference paper
Publications
9296 results for Computer Science
Effects of texture, microstructure, and alloy content on electromigration of aluminum-based metallization
- D.B. Knorr
- K.P. Rodbell
- 1992
- SPIE Microelectronic Processing 1992
Conference paperPerformance consideration for the scaling of sub-micron on-chip interconnections
- Yuh-Jier Mii
- 1992
- SPIE Microelectronic Processing 1992
Conference paperElectromigration and stress reliability in multilevel interconnect metallization
- Paul S. Ho
- M.A. Moske
- et al.
- 1992
- SPIE Microelectronic Processing 1992
Conference paperElectromigration and current-carrying implications for aluminum-based metallurgy with tungsten stud-via interconnections
- H.S. Rathore
- R. Filippi
- et al.
- 1992
- SPIE Microelectronic Processing 1992
Conference paperA simple linear-time algorithm for the recognition of bandwidth-2 biconnected graphs
- Fillia Makedon
- Dafna Sheinwald
- et al.
- 1993
- Information Processing Letters
PaperAutomatic defect classification for integrated circuits
- Paul B. Chou
- A. ILao Ravishankar
- et al.
- 1993
- IS&T/SPIE Electronic Imaging 1993
Conference paperPhase plates in the object plane for microlithography
- M. Levenson
- 1993
- SPIE OE/LASE 1993
Conference paperHigh pressure CVD tungsten-stud formation using RIE cluster processes
- H.Y. Ng
- D.J. Dichauzi
- 1992
- SPIE Microelectronic Processing 1992
Conference paperParallel dynamic st-numbering and applications
- E. Dekel
- J. Hu
- 1993
- IPPS 1993
Conference paper