Publications

62 results for Chiplets

Warpage analysis of organic substrates for 2.1D packaging
- - Sayuri Kohara
  - Keishi Okamoto
  - et al.
- 2015
- 3DIC 2015
Advances in percolated thermal underfill (PTU) simulations for 3D-integration
- - Sridhar Kumar
  - Uwe Zschenderlein
  - et al.
- 2015
- EuroSimE 2015