Competitive and cost effective copper/low-k interconnect (BEOL) for 28nm CMOS technologies
- Rod Augur
- Craig Child
- et al.
- 2010
- ADMETA 2010
Conference paper
Publications
26856 results for Science
Processing and moisture effects on TDDB for Cu/ULK BEOL structures
- Eric G. Liniger
- T.M. Shaw
- et al.
- 2010
- ADMETA 2010
Conference paperEvolution of stress gradients in Cu thin films induced by capping layers
- 2010
- ADMETA 2010
Conference paperEmpirical methods for two-echelon inventory management with service level constraints based on simulation-regression
- Lin Li
- Karthik Sourirajan
- et al.
- 2010
- WSC 2010
Conference paperCopper microstructure: Effect on electromigration void evolution
- C. Witt
- V. Calero
- et al.
- 2010
- ADMETA 2010
Conference paperSmaller, smarter, faster, and more accurate: The new overlay metrology
- 2010
- SPIE Advanced Lithography 2010
Conference paperAvatars meet meetings: Design issues in integrating avatars in distributed corporate meetings
- N. Sadat Shami
- Li-Te Cheng
- et al.
- 2010
- GROUP 2010
Conference paperAn evaluation of feature sets and sampling techniques for de-identification of medical records
- James Gardner
- Li Xiong
- et al.
- 2010
- IHI 2010
Conference paperLarge-scale multimodal mining for healthcare with MapReduce
- Fei Wang
- Vuk Ercegovac
- et al.
- 2010
- IHI 2010
Conference paperEffective Cu surface pre-treatment for high-reliable 22nm-node Cu dual damascene interconnects with high plasma resistant ultra low-k dielectric (k=2.2)
- F. Ito
- H. Shobha
- et al.
- 2010
- ADMETA 2010
Conference paper