Fully Encapsulated Fine Pitch Dual Damascene Organic RDL With Low Dk Df Photosensitive Polyimide and its Reliability
- Minhua Lu
- Joyce Liu
- et al.
- 2025
- ECTC 2025
Conference paper
Publications
288 results for AI Hardware
Effect of Pressure-dependent TIM Thermal Resistance on Thermal Performance of First-level Packages
- KALIND BARAYA
- Krishna Tunga
- et al.
- 2025
- ITherm 2025
Conference paperElectrical Performance of Hybrid Bonding with Sub-Micron Cu-Cu Bonding Contacts: Effects of Scaling, Microstructure, and Surface Morphology
- Sari Al Zerey
- Alina Bennett
- et al.
- 2025
- ECTC 2025
Conference paperA Multiscale Workflow for Thermal Analysis of 3DI Chip Stacks
- Max Bloomfield
- Amogh Wasti
- et al.
- 2025
- ITherm 2025
Conference paperFast and Accurate Machine Learning Prediction of Back-End-of-Line Thermal Resistances in Backside Power Delivery and Chiplet Architectures
- Prabudhya Roy Chowdhury
- Aakrati Jain
- et al.
- 2025
- ECTC 2025
Conference paperExperimental Cross-Plane Thermal Transport Characterization of BEOL Materials and Sensitivity to In-Plane Thermal Transport
- Amogh Wasti
- Zongmin Yang
- et al.
- 2025
- ITherm 2025
Conference paperNIMA: Near In-Memory High-Precision Accumulation Unit for Heterogeneous Analog/Digital Deep Learning Acceleration
- Irem Sanli
- Elena Ferro
- et al.
- 2025
- ISCAS 2025
Conference paperLive Demonstration: Automated DNN Deployment on the IBM HERMES Project Chip
- Corey Lammie
- Julian Büchel
- et al.
- 2025
- ISCAS 2025
Demo paperAll-in-One Analog AI Hardware: On-Chip Training and Inference with Conductive-Metal-Oxide/HfOx ReRAM Devices
- Donato Francesco Falcone
- Victoria Clerico
- et al.
- 2025
- Advanced Functional Materials
PaperHardware Implementation of Ring Oscillator Networks Coupled by BEOL Integrated ReRAM for Associative Memory Tasks
- Wooseok Choi
- Thomas Van Bodegraven
- et al.
- 2025
- IMW 2025
Conference paper