A mass-balanced through-wafer electrostatic x/y-scanner for probe data storage
- J.B.C. Engelen
- H. Rothuizen
- et al.
- 2009
- Microelectronic Engineering
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221 results at Microelectronic Engineering
CMOS compatible cost-efficient fabrication of SOI grating couplers
- Jens Bolten
- Jens Hofrichter
- et al.
- 2009
- Microelectronic Engineering
Phase change materials and their application to random access memory technology
- Simone Raoux
- Robert M. Shelby
- et al.
- 2008
- Microelectronic Engineering
Thermal stress effects of Ge2Sb2Te5 phase change material: Irreversible modification with Ti adhesion layers and segregation of Te
- K.N. Chen
- C. Cabral Jr.
- et al.
- 2008
- Microelectronic Engineering
Extensive investigations of temperature influence on barrier integrity during reliability testing
- O. Aubel
- M.A. Meyer
- et al.
- 2008
- Microelectronic Engineering
Fabrication and characterization of Ta2O5 photonic feedback structures
- T. Wahlbrink
- J. Bolten
- et al.
- 2008
- Microelectronic Engineering
Minimizing linewidth roughness in Step and Flash Imprint Lithography
- Niyaz Khusnatdinov
- Gerard M. Schmid
- et al.
- 2008
- Microelectronic Engineering
Stress evolution during Ni-Si compound formation for fully silicided (FUSI) gates
- C. Torregiani
- C. Van Bockstael
- et al.
- 2007
- Microelectronic Engineering
Ni-Pt silicide formation through Ti mediating layers
- Paul Besser
- Christian Lavoie
- et al.
- 2007
- Microelectronic Engineering
Dopant segregation in SOI Schottky-barrier MOSFETs
- J. Knoch
- M. Zhang
- et al.
- 2007
- Microelectronic Engineering