Publications

56 results for Chiplets

Evolution of patterning materials towards the Moore's Law 2.0 Era
- - Dario L. Goldfarb
- 2022
- Japanese Journal of Applied Physics
Interconnects for DNA, Quantum, In-Memory, and Optical Computing: Insights From a Panel Discussion
- - Amlan Ganguly
  - Sergi Abadal
  - et al.
- 2021
- IEEE Micro
Plasma Activated Low-temperature Die-level Direct Bonding with Advanced Wafer Dicing Technologies for 3D Heterogeneous Integration
- - Katsuyuki Sakuma
  - Dishit Parekh
  - et al.
- 2021
- ECTC 2021
Copper Content Optimization for Warpage Minimization of Substrates with an Asymmetric Cross-Section by Genetic Algorithm
- - Hiroyuki Mori
  - Sayuri Kohara
- 2021
- ECTC 2021
3D Die-Stack on Substrate (3D-DSS) Packaging Technology and FEM Analysis for 55um-75um Mixed Pitch Interconnections on High Density Laminate
- - Katsuyuki Sakuma
  - Mukta Farooq
  - et al.
- 2021
- ECTC 2021
Co-package technology platform for low-power and low-cost data centers
- - Konstantinos Papatryfonos
  - David R. Selviah
  - et al.
- 2021
- Applied Sciences
3-D Die Stacking with 55 μm Pitch Interconnections on Advanced Ground-Rule Laminate for Artificial Intelligence System
- - Katsuyuki Sakuma
  - Mukta Farooq
  - et al.
- 2021
- IEEE Transactions on CPMT
Packaging and Antenna Integration for Silicon-Based Millimeter-Wave Phased Arrays: 5G and Beyond
- - Xiaoxiong Gu
  - Duixian Liu
  - et al.
- 2021
- IEEE Journal of Microwaves
Optical Communication and Energy Conversion for Small-Footprint Edge Computing
- - Ning Li
- 2020
- MRS Spring/Fall Meeting 2020
Plating-free Bumping by Cu Nanopaste and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining
- - Toyohiro Aoki
  - Eiji Nakamura
  - et al.
- 2020
- ECTC 2020