Application of three-parameter lognormal distribution in EM data analysis
- Baozhen Li
- Emmanuel Yashchin
- et al.
- 2006
- Microelectronics Reliability
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44 results at Microelectronics Reliability
The effect of Cu diffusion on the TDDB behavior in a low-k interlevel dielectrics
- J.R. Lloyd
- C.E. Murray
- et al.
- 2006
- Microelectronics Reliability
Determination of the thermal conductivity of composite low-k dielectrics for advanced interconnect structures
- F. Chen
- J. Gill
- et al.
- 2006
- Microelectronics Reliability
Electromigration of Cu/low dielectric constant interconnects
- C.-K. Hu
- L. Gignac
- et al.
- 2006
- Microelectronics Reliability
The negative bias temperature instability in MOS devices: A review
- J.H. Stathis
- S. Zafar
- 2006
- Microelectronics Reliability
Considerations for evaluating hot-electron reliability of strained Si n-channel MOSFETs
- D.Q. Kelly
- S. Dey
- et al.
- 2005
- Microelectronics Reliability
Effects of radiation and charge trapping on the reliability of high- κ gate dielectrics
- J.A. Felix
- J.R. Schwank
- et al.
- 2004
- Microelectronics Reliability
Why hot carrier emission based timing probes will work for 50 nm, 1V CMOS technologies
- J.C. Tsang
- M.V. Fischetti
- 2001
- Microelectronics Reliability
Invited paper environmental effects on interfacial adhesion
- M.W. Lane
- J.M. Snodgrass
- et al.
- 2001
- Microelectronics Reliability
PICA: Backside failure analysis of CMOS circuits using picosecond imaging circuit analysis
- M. McManus
- J.A. Kash
- et al.
- 2000
- Microelectronics Reliability