Latchup Analysis Using Emission Microscopy
- Franco Stellari
- Peilin Song
- et al.
- 2003
- Microelectronics Reliability
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44 results at Microelectronics Reliability
Circuit implications of gate oxide breakdown
- J.H. Stathis
- R. Rodríguez
- et al.
- 2003
- Microelectronics Reliability
Backside flip-chip testing by means of high-bandwidth luminescence detection
- A. Tosi
- F. Stellari
- et al.
- 2003
- Microelectronics Reliability
Faster IC analysis with PICA spatial temporal photon correlation and CAD autochanneling
- R. Desplats
- A. Eral
- et al.
- 2003
- Microelectronics Reliability
Dependence of post-breakdown conduction on gate oxide thickness
- S. Lombardo
- J.H. Stathis
- et al.
- 2002
- Microelectronics Reliability
Analysis of the effect of the gate oxide breakdown on SRAM stability
- R. Rodríguez
- J.H. Stathis
- et al.
- 2002
- Microelectronics Reliability
Optical diagnosis of excess IDDQ in low power CMOS circuits
- Franco Stellari
- Peilin Song
- et al.
- 2002
- Microelectronics Reliability
Why hot carrier emission based timing probes will work for 50 nm, 1V CMOS technologies
- J.C. Tsang
- M.V. Fischetti
- 2001
- Microelectronics Reliability
Invited paper environmental effects on interfacial adhesion
- M.W. Lane
- J.M. Snodgrass
- et al.
- 2001
- Microelectronics Reliability
PICA: Backside failure analysis of CMOS circuits using picosecond imaging circuit analysis
- M. McManus
- J.A. Kash
- et al.
- 2000
- Microelectronics Reliability