Electrotransport in copper alloy films and the defect mechanism in grain boundary diffusion
- F.M. D'Heurle
- A. Gangulee
- 1975
- Thin Solid Films
Paper
Publications
3555 results for Materials Discovery
Mass transport during electromigration in aluminum-magnesium thin films
- A. Gangulee
- F.M. d'Heurle
- 1975
- Thin Solid Films
PaperPreparation and properties of polycrystalline films of (TTF)(TCNQ)
- T.H. Chen
- B.H. Schechtman
- 1975
- Thin Solid Films
PaperThe transient layer in magnetic garnet films grown by liquid phase epitaxy
- J.E. Davies
- E.A. Giess
- et al.
- 1975
- Materials Research Bulletin
PaperImplanted noble gas atoms as diffusion markers in silicide formation
- W.K. Chu
- S.S. Lau
- et al.
- 1975
- Thin Solid Films
PaperSources of conduction band polarization in the driving force for electromigration
- Rolf Landauer
- 1975
- Thin Solid Films
PaperA dislocation cascade mechanism in superplasticity
- P. Chaudhari
- 1974
- Metallurgical and Materials Transactions B: Process Metallurgy and Materials Processing Science
PaperDelay-bond graph models for geared torsional systems
- N.T. Tsai
- S.M. Wang
- 1974
- Journal of Applied Mechanics, Transactions ASME
PaperStatic determinaoy in the theory of finite width foil bearings
- W.E. Langlois
- 1974
- Journal of Applied Mechanics, Transactions ASME
PaperGrain growth in Ni-Fe thin films
- A. Gangulee
- S. Krongelb
- et al.
- 1974
- Thin Solid Films
Paper