Effects of minor additions of Zn on interfacial reactions of Sn-Ag-Cu and Sn-Cu solders with various Cu substrates during thermal aging
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- Sung K. Kang
- et al.
- 2007
- Journal of Electronic Materials
Paper
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Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition
- Sung K. Kang
- Donovan Leonard
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- 2006
- Journal of Electronic Materials
PaperBonding parameters of blanket copper wafer bonding
- K.N. Chen
- A. Fan
- et al.
- 2006
- Journal of Electronic Materials
PaperInvestigations of strength of copper-bonded wafers with several quantitative and qualitative tests
- K.N. Chen
- S.M. Chang
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- 2006
- Journal of Electronic Materials
PaperThe effect of forming gas anneal on the oxygen content in bonded copper layer
- C.S. Tan
- K.N. Chen
- et al.
- 2005
- Journal of Electronic Materials
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- André Knoesen
- Ge Song
- et al.
- 2004
- Journal of Electronic Materials
PaperEffects of phosphorus content on the reaction of electroless Ni-P with Sn and crystallization of Ni-P
- Y.C. Sohn
- Jin Yu
- et al.
- 2004
- Journal of Electronic Materials
PaperHigh-quality crystalline layer transfer from a silicon-on-insulator substrate onto a sapphire substrate using wafer bonding
- D. Singh
- L.T. Shi
- et al.
- 2003
- Journal of Electronic Materials
PaperIsothermal Aging of Near-Eutectic Sn-Ag-Cu Solder Alloys and Its Effect on Electrical Resistivity
- B.A. Cook
- I.E. Anderson
- et al.
- 2003
- Journal of Electronic Materials
Conference paperEffects of Mechanical Deformation and Annealing on the Microstructure and Hardness of Pb-Free Solders
- Paul Lauro
- Sung K. Kang
- et al.
- 2003
- Journal of Electronic Materials
Conference paper