Terabit/sec-class board-level optical interconnects through polymer waveguides using 24-channel bidirectional transceiver modules
- Fuad E. Doany
- Clint L. Schow
- et al.
- 2011
- ECTC 2011
Conference paper
Publications
16 results at ECTC 2011
Surface-tension-driven multi-chip self-alignment techniques for heterogeneous 3D integration
- Fengda Sun
- Yusuf Leblebici
- et al.
- 2011
- ECTC 2011
Conference paperLow-profile 3D silicon-on-silicon multi-chip assembly
- Paul Andry
- Bing Dang
- et al.
- 2011
- ECTC 2011
Conference paperHigh-bandwidth density optical I/O for high-speed logic chip on waveguide-integrated organic carrier
- Masao Tokunari
- Yutaka Tsukada
- et al.
- 2011
- ECTC 2011
Conference paper3D Chip stacking with 50 μm pitch lead-free micro-c4 interconnections
- Joana Maria
- Bing Dang
- et al.
- 2011
- ECTC 2011
Conference paperA through-silicon-via to active device noise coupling study for CMOS SOI technology
- Xiaomin Duan
- Xiaoxiong Gu
- et al.
- 2011
- ECTC 2011
Conference paper