Effect of contact implants on the patterning of tungsten damascene interconnectsJ.P. GambinoM.A. Jasoet al.1996MRS Spring Meeting 1996
Copper migration and precipitate dissolution in aluminum/copper lines during electromigration testingT.M. ShawC.-K. Huet al.1996MRS Spring Meeting 1996
Nanofoam porosity measured by infrared spectroscopy and refractive indexM.I. SanchezJ.L. Hedricket al.1996MRS Spring Meeting 1996