C4NP Cu-cored Pb-free flip chip interconnections
- Jae-Woong Nah
- Stephen L. Buchwalter
- et al.
- 2008
- ECTC 2008
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18 results at ECTC 2008
50μm pitch Pb-free micro-bumps by C4NP technology
- Bing Dang
- Da-Yuan Shih
- et al.
- 2008
- ECTC 2008
Development of a 50mm dual flip chip plastic land grid array package for server applications
- Sylvain Ouimet
- Jon Casey
- et al.
- 2008
- ECTC 2008
300-Gb/s 24-channel bidirectional Si carrier transceiver optochip for board-level interconnects
- Fuad E. Doany
- Clint L. Schow
- et al.
- 2008
- ECTC 2008
Performance improvement of stacked graphite sheets for cooling applications
- Yoichi Taira
- Sayuri Kohara
- et al.
- 2008
- ECTC 2008
High-density optical interconnect exploiting build-up waveguide-on-SLC board
- Shigeru Nakagawa
- Yoichi Taira
- et al.
- 2008
- ECTC 2008
3D silicon integration
- J. Knickerbocker
- P. Andry
- et al.
- 2008
- ECTC 2008
Chip package interaction evaluation for a high performance 65nm and 45nm CMOS technology in a stacked die package with C4 and wirebond interconnections
- Christopher Muzzy
- David Danovitch
- et al.
- 2008
- ECTC 2008