High-speed multiresolution scanning probe microscopy based on Lissajous scan trajectories
- Tomas Tuma
- John Lygeros
- et al.
- 2012
- Nanotechnology
Review
Publications
14467 results for Physical Sciences
Post porosity plasma protection: Scaling of efficiency with porosity
- Theo Frot
- Willi Volksen
- et al.
- 2012
- Advanced Functional Materials
PaperEffects of Ti addition to Sn-Ag and Sn-Cu solders
- W.M. Chen
- S.K. Kang
- et al.
- 2012
- Journal of Alloys and Compounds
PaperLow resistivity tungsten for 32 nm node MOL contacts and beyond
- Filippos Papadatos
- Keith Wong
- et al.
- 2012
- Microelectronic Engineering
PaperSynergistic combinations of dielectrics and metallization process technology to achieve 22 nm interconnect performance targets
- G.A. Antonelli
- G. Jiang
- et al.
- 2012
- Microelectronic Engineering
PaperEffective Cu surface pre-treatment for high-reliable 22 nm-node Cu dual damascene interconnects with high plasma resistant ultra low-k dielectric (k = 2.2)
- F. Ito
- H. Shobha
- et al.
- 2012
- Microelectronic Engineering
PaperEvolution of stress gradients in Cu films and features induced by capping layers
- Conal E. Murray
- E.T. Ryan
- et al.
- 2012
- Microelectronic Engineering
PaperCo capping layers for Cu/low-k interconnects
- C.-C. Yang
- P. Flaitz
- et al.
- 2012
- Microelectronic Engineering
PaperCompetitive and cost effective copper/low-k interconnect (BEOL) for 28 nm CMOS technologies
- R. Augur
- C. Child
- et al.
- 2012
- Microelectronic Engineering
PaperInAs nanowire growth on oxide-masked 〈111〉 silicon
- Mikael T. Björk
- Heinz Schmid
- et al.
- 2012
- Journal of Crystal Growth
Paper