A Switched-Capacitor Integer Compute Unit with Decoupled Storage and Arithmetic for Cloud AI Inference in 5nm CMOS
- Ankur Agrawal
- Monodeep Kar
- et al.
- 2023
- VLSI Technology 2023
Conference paper
Publications
Quantum Dots Array on Ultra-Thin SOI Nanowires with Ferromagnetic Cobalt Barrier Gates for Enhanced Spin Qubit Control
- Fabio Bersano
- Michele Aldeghi
- et al.
- 2023
- VLSI Technology 2023
Conference paperA 1.9GHz 0.57V Vmin 576Kb embedded product-ready L2 cache in 5nm FinFET technology
- N. Jungmann
- Rajiv V. Joshi
- et al.
- 2023
- VLSI Technology 2023
Conference paperContact Cavity Shaping and Selective SiGe:B Low-Temperature Epitaxy Process Solution for sub 10-9 Ω.cm2 Contact Resistivity in Nonplanar FETs
- N. Breil
- B.-C. Lee
- et al.
- 2023
- VLSI Technology 2023
Conference paperSolder Joint Reliability of Fully Homogenised SAC-SnBi Low Temperature BGA Interconnections using Solid Liquid Inter-Diffusion (SLID)
- Hafiz Wakas Ali
- David Danovitch
- et al.
- 2023
- ECTC 2023
Conference paperSignal and Power Integrity Design and Analysis for Bunch-of-Wires (BoW) Interface for Chiplet Integration on Advanced Packaging
- Ram Krishna
- Atom O. Watanabe
- et al.
- 2023
- ECTC 2023
Conference paperComparison of sintering methodologies for 3D printed high-density interconnects (2.3 µm L/S) on organic substrates for high-performance computing applications
- Shrivani Pandiya
- Serge Ecoffey
- et al.
- 2023
- ECTC 2023
Conference paper1.65 µm L/S high density interconnect on organic substrate by advanced semi-additive process for HPC applications
- Hussein Hamieh
- Juliano Borges
- et al.
- 2023
- ECTC 2023
Conference paperHigh Density Photonic Reservoir Computing using Optical Fiber and Polymer Waveguide
- Hidetoshi Numata
- Toshiyuki Yamane
- et al.
- 2023
- ECTC 2023
Conference paperA Scalable Heterogeneous AiP Module for a 256-Element 5G Phased Array
- Duixian Liu
- Xiaoxiong Gu
- et al.
- 2023
- ECTC 2023
Conference paper